![]() Heat transfer at high temperatures can cause spattering and solder balling, as well as oxidation of pastes, attachment pads, and component terminations. The soak time for different pastes varies, but typically it is between 60 and 120 seconds. Most of the flux evaporates from the solder paste. In the soak segment, the solder paste approaches a phase change. Usually, the process limit is set at 4☌/s, but some manufacturers specify 2☌/s. Ramp refers to the rate at which temperature changes over time. In reflow soldering, a sufficient amount of heat melts the solder and forms joints without causing any damage to components or the circuit board. Ramp-Soak-Spike (RSS) and Ramp to Spike (RTS)Ī typical reflow profile consists of four stages that include preheating, thermal soak, reflow, and cooling zones. There are two main types of thermal profiles: The ramp-soak-spike (RSS) and the ramp to spike (RTS). Presently, compliance and quality assurance are critical issues. ![]() Provides reliable data to optimize the process and make adjustments wherever relevant. ![]()
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